Waferpedia

Tool family

STS 310

STSDeposition1 entry

The STS 310 is a plasma-enhanced chemical-vapor-deposition system used in the source to deposit silicon dioxide and silicon nitride films.

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Models in this family

  1. 310

    The STS 310 is a plasma-enhanced chemical-vapor-deposition (PECVD) system used for depositing silicon dioxide and silicon nitride films on 100-mm diameter wafers.