Tool family
The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.
The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 720 (right chamber) | — | — | Designated for chlorine and fluorine based etching of 2D materials and perovskites | cnf.cornell.edu[1] |
| 740 (left chamber) | — | — | Designated as Au exposure system, can etch metals and dielectrics with either Au exposure or termination | cnf.cornell.edu[1] |