Tool family
The K&S Rapid Pro Automatic Wire Bonder is an automatic ball bonder from the GEN-S series designed for high-performance semiconductor packaging with real-time monitoring and diagnostics.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| RAPID Pro LA | — | — | Large Area bonding: Y axis 87 mm | scribd.com[1] |
| RAPID Pro ELA | — | — | Extended Large Area bonding: Y axis 80 mm | scribd.com[1] |
| RAPID Pro LA (Large Area) | — | — | Large area bondable area configuration | zaratech.biz[2] |
| RAPID Pro ELA (Extended Large Area) | — | — | Extended large area bondable area configuration | zaratech.biz[2] |