Waferpedia

Tool family

Hesse & Knipps Bondjet BJ885

The Bondjet BJ855 and Bondjet BJ885 are the latest generation of fully automated fine wire bonders from Hesse, supporting wedge-wedge and ball-wedge bonding.

Models in this family

  1. Bondjet BJ885latest generation of fully automated fine wire bonders

    The Bondjet BJ855 and Bondjet BJ885 are the latest generation of fully automated fine wire bonders from Hesse, supporting wedge-wedge and ball-wedge bonding.

    Cited variants

    DesignationGenerationVintageChangesSource
    Bondjet BJ855——Working area X 305 mm, Y 410 mm, Z 19 mm; footprint 740 x 1484 x 1912 mm; weight ca. 1150 kghesse-mechatronics.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]hesse-mechatronics.comhesse-mechatronics.com