Waferpedia

Tool family

Esec Datacon 2200 evo

The Datacon 2200 evo is a die bonder for epoxy die attach applications.

Models in this family

  1. Datacon 2200 evo3rd generation

    The Datacon 2200 evo is a die bonder for epoxy die attach applications.

    Cited variants

    DesignationGenerationVintageChangesSource
    Datacon 2200 evo plus———besi.com[1]
    Datacon 2200 evo hF———besi.com[1]
    Datacon 2200 evo hS———besi.com[1]
    Datacon 2200 evo advanced———besi.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]besi.combesi.com