Esec 2008 HS 3

Models in this family

1. 2008 HS 3

   The Esec 2008 HS 3 is a die bonder used in semiconductor packaging and bonding.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   2008 HS 3 P	—	—	—	waferpedia.com[1]
   2008 HS 3 Plus	—	—	—	waferpedia.com[2]

Sources