Waferpedia

Comparison ledger

10490versus4546E

West Bond 10490, West Bond 4546E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
4546EWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10490West Bond 4546E
Specifications
ManufacturerWest Bond[1]—
Model10490[1]4546E[4]
DescriptionConvertible bonder, wedge to ball[2]—
Tool typeConvertible bonder[3]semi-automatic wedge bond tool[4]
Bonding modesWedge bonding and ball bonding[3]—
UseWire bonding[3]—
Vendor—West-Bond Inc.[4]
Motion control—microprocessor controllable motion in Z and Y axes[4]
Bonding method—uses ultrasonic energy[4]
Typical wire configuration—1 mil (25 μm) Al wire (wedge bonding configuration)[4]
Convertible bonding modes—45° wedge and 90° (deep access) wedge bonding[4]
Wire compatibility—Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding[4]
Transducer—5 W, 63 kHz[4]
Bond placement aid—look down camera and screen[4]
Bonding control—programmable bonding steps for repeatable wire profile control[4]
Programming—programmable bonding steps for repeatable wire profile control[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]uwaterloo.cauwaterloo.ca