Comparison ledger
View Engineering 1101, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1101View Engineering | 10100West Bond |
|---|---|---|
| OEM | View Engineering | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | 1982 | — |
| Production run | 1982– | — |
| Lifecycle | Legacy | — |
| Lifecycle milestones | 1982 Introduction | — |
| Control system | — | — |
| Generation | 2nd generation | — |
| Family | View Engineering 1101 | West Bond 10100 |
| Specifications | ||
| Generation | 2nd generation[1] | — |
| Image type | binary image[1] | — |
| System type | pattern recognition system[1] | — |
| Application | automated wirebonding machines and wafer probers[1] | — |
| Introduction year | 1982[1] | — |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →