Comparison ledger
TEGAL 211, Tokyo Electron Mark VIII, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 211TEGAL | Mark VIIITokyo Electron |
|---|---|---|
| OEM | TEGAL | Tokyo Electron |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | TEGAL 211 | Tokyo Electron Mark |
| Cited variants | — |
|
| Specifications | ||
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Process Type | Plasma Asher/Etcher[3] | — |
| Wafer Size (max) | 3 inch[3] | — |
| Form Factor | Table top[3] | — |
| Chamber Material | Aluminum[2] | — |
| Chamber Internal Dimensions | 6 x 6 x 3.75 inches[2] | — |
| Timer Range | 0-99 minutes[3] | — |
| Configuration | — | 2 develop, 1 coat, 3 chill hot plates, 4 low temp hot plates, 1 high temp hot plate, WEE - Main Frame: Single Block[4] |
| Gas | — | Polyimide[4] |
| OS | — | DOS[4] |
| 2D, 1WEE, 3HP, 4CHP, 3COL - Main Frame | — | Dual Block[1] |
| 2D, 1WEE, 9HP, 3COL - Main Frame | — | Dual Block[6] |
| Main Frame | — | Single Block[4] |
| Operating System | — | DOS 1996 Vintage[4] |
| Vintage | — | 1996[4] |
| Equipment type | — | Developer[4] |
| Make | — | Tel[4] |
| Model | — | Mark VIII[4] |
| Develop cups | — | 2[5] |
| Coat cup | — | 1[4] |
| Hot plates | — | 3 chill hot plates, 4 low temp hot plates, 1 high temp hot plate[4] |
| Chill plates | — | 4 chill plates[5] |
| Control software | — | DOS[4] |
| OEM | — | Tokyo Electron[4] |
| Control system / OS | — | DOS[4] |
| Type | — | Developer[4] |
| Coat Cups | — | 1[4] |
| Chill Hot Plates | — | 3[4] |
| Low Temp Hot Plates | — | 4[4] |
| High Temp Hot Plates | — | 1[4] |
| Chill Plates | — | 3[5] |
| Process Gases | — | Polyimide[4] |
| Vintage Year | — | 1996[4] |
| WEE | — | Right[5] |
| Process configuration | — | 2 develop, 1 coat, 3 chill hot plates, 4 low temp hot plates, 1 high temp hot plate, WEE - Main Frame: Single Block - Gas: Polyimide - OS: DOS[4] |
| Low temp hot plates | — | 3[5] |
| High temp hot plate | — | 1[4] |
| WEE Right | — | present[5] |
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