Waferpedia

Comparison ledger

1512eversusTelius SCCM Jin Oxide

Tegal 1512e, Tokyo Electron Telius SCCM Jin Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
Telius SCCM Jin OxideTokyo Electron
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1512eTokyo Electron Telius SCCM Jin Oxide
Specifications
Tool typeIndustrial RIE plasma etcher system[1]—
Stated configurationWith modules assembly for CI-4222[1]—
Equipment type—Oxide etcher[2]
Wafer size—300 mm[3]
Category—Etch[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com