Comparison ledger
SUSS MicroTec SB 6, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SB 6SUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec SB 6 | West Bond 10490 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Pneumatic Block replaced with a SMC Solenoid Block[3] | — |
| Wafer size | Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C[3] | — |
| Temperature range | 50°C to 550°C[4] | — |
| Vacuum pressure | 5e-5 to 3e-3 Torr[3] | — |
| Base pressure | <5x10^-5 mbar[1] | — |
| Process pressure range (source 3) | 5e-5 to 3e3 mBar[4] | — |
| Maximum force | 20 kN[4] | — |
| Anodic bonding voltage | up to 2000 V[4] | — |
| Temperature accuracy | +/- 5 degrees[4] | — |
| Temperature uniformity | +/- 3%[4] | — |
| Heating | Upper and lower heating[4] | — |
| Control system | Windows-based computer control[4] | — |
| Bond head size | 150 mm[1] | — |
| Substrate sizes supported | 100 mm wafers, 3 inch wafers, small pieces[1] | — |
| Compatible bonding processes | Adhesive, Anodic, Eutectic, Fusion, Glass frit, Thermal compression[1] | — |
| Wafer Size | 6 inch (150 mm)[3] | — |
| Bonding Pressure Range | 5e-5 to 3e-3 Torr[3] | — |
| Achievable Chamber Pressure | < 5x10^-5 mbar[1] | — |
| Supported Bonding Processes | Adhesive, Anodic, Eutectic, Fusion, Glass frit[1] | — |
| Manufacturer | — | West Bond[5] |
| Model | — | 10490[5] |
| Description | — | Convertible bonder, wedge to ball[6] |
| Tool type | — | Convertible bonder[7] |
| Bonding modes | — | Wedge bonding and ball bonding[7] |
| Use | — | Wire bonding[7] |
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