Waferpedia

Comparison ledger

HP8 / CP8 / VP8versusLabSpin6 / 8

SUSS MicroTec HP8 / CP8 / VP8, SUSS MicroTec LabSpin6 / 8, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
HP8 / CP8 / VP8SUSS MicroTec
LabSpin6 / 8SUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
Category——
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec HP8 / CP8 / VP8SUSS MicroTec LabSpin6 / 8
Specifications
System typeManual[1]—
Wafer sizeup to 200 mm[1]—
ProcessesBaking, Cooling, Vapor Priming[1]—
Substrate Size—up to 200 mm[1]
Process Capability—Spin coating, Puddle developing[1]
Operation Type—Manual[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]hilpert.chhilpert.ch