Comparison ledger
SUSS MicroTec ELD300, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ELD300SUSS MicroTec | 10100West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 300mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ELD300 | West Bond 10100 |
| Specifications | ||
| Operation | Semi-automated[1] | — |
| Wafer Size | up to 300 mm[1] | — |
| Process | Excimer Laser-Assisted Debonding[1] | — |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →