Comparison ledger
Signatone 1070, Teradyne Nextest Magnum II X GV, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1070Signatone | Nextest Magnum II X GVTeradyne |
|---|---|---|
| OEM | Signatone | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Signatone 1070 | Teradyne Nextest Magnum |
| Specifications | ||
| Make | Signatone[1] | — |
| Model | 1070[1] | — |
| Test head | — | 8 Chassis[2] |
| Configuration | — | HSB 3 (qty 16)[2] |
| DBM Size | — | 18(2) GBIT[2] |
| ECRM Size | — | 72(4) GBIT[2] |
| RCM Size | — | 36(2) Mbit[2] |
Plan your fab
Building a Test & Probe process? Get a complete equipment list.
Open the fab equipment planner →