Comparison ledger
Nikon NSR S 208 D, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NSR S 208 DNikon | 150 e MaskSUSS MicroTec |
|---|---|---|
| OEM | Nikon | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nikon NSR S 208 | SUSS MicroTec 150 e Mask |
| Specifications | ||
| Configuration | Software ver. MCSW 180-P12/OCSW ver. 180-P10[1] | — |
| CIM | SECs[1] | — |
| Process | kRF[1] | — |
| Handler System | external FOUP system[1] | — |
| Factory Interface | SMIF[1] | — |
| Wavelength | 248 nm[2] | — |
| Lens NA | 0.82[2] | — |
| Exposure Area | 26 x 33 mm[2] | — |
| Reduction Ratio | 1/4[2] | — |
| Resolution | <110 nm[2] | — |
| Throughput (300 mm) | >147 wph[2] | — |
| Throughput (200 mm) | >165 wph[2] | — |
| Wafer Size | 200/300 mm[2] | — |
| Software Version | MCSW 180-P12 / OCSW ver. 180-P10[1] | — |
| Components | Amp Rack, Temperature Controller, Cymer Laser, Air Conditioner[1] | — |
| Throughput | 300 mm > 147 WPH; 200 mm > 165 WPH[2] | — |
| Included modules | Amp Rack; Temperature Controller; Cymer Laser; Air Conditioner[1] | — |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →