Comparison ledger
MRSI H3, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H3MRSI | 10490West Bond |
|---|---|---|
| OEM | MRSI | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2019 Renamed product name · 2019 Name change for shipments | — |
| Control system | — | — |
| Generation | — | — |
| Family | MRSI H3 | West Bond 10490 |
| Cited variants | — | |
| Specifications | ||
| Placement accuracy (3 sigma, before improvement) | ±3 micrometers[1] | — |
| Placement accuracy (3 sigma, after improvement) | ±1.5 micrometers[1] | — |
| Product line type | high-speed, high-precision and flexible eutectic and epoxy die bonding systems[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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