Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond wirebond-R1, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | wirebond-R1West Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond wirebond-R1 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Vendor | — | West-Bond Inc.[2] |
| Model | — | 7476E[2] |
| Purpose | — | Used for making electrical contacts between semiconductor dies and packages[2] |
| Equipment description | — | Manual wirebonding tool designed to make electrical interconnects between integrated circuit packages and integrated circuit dies[2] |
| Bonding configurations | — | 45° wedge bonding and 90° wedge bonding (deep access)[2] |
| Wire compatibility | — | Optimized for Au or Al wires with a 25 μm (0.001") diameter; compatible with Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding[2] |
| Ultrasonic transducer | — | 4 W 63 kHz[2] |
| Manual control | — | Available via 8:1 reduction ratio micromanipulator arm[2] |
| Wire types | — | Aluminum and gold wires from 0.7 mil to 2 mil in diameter[2] |
| Optimized wire diameter | — | 25 μm (0.001″)[2] |
| Bonding modes | — | 45° wedge and 90° (deep access) wedge configurations[2] |
| Bonding type | — | Room temperature thermosonic bonding[2] |
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