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Comparison ledger

1 WBS 1 Wafer SubstrateversusCB 200 M Wafer

Logitech 1 WBS 1 Wafer Substrate, SUSS MicroTec CB 200 M Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1 WBS 1 Wafer SubstrateLogitech
CB 200 M WaferSUSS MicroTec
OEMLogitechSUSS MicroTec
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateSUSS MicroTec CB 200 M Wafer
Specifications
Wafer Size6 inch[1]8 inch[2]
Category—Packaging & Bonding[3]
Vintage—2012[2]
Type—Wafer Bonder[2]
1 WBS 1 Wafer Substrate entryCB 200 M Wafer entryAsk about these tools →Share experience with this comparison →

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com