Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, Palomar 9000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 9000Palomar |
|---|---|---|
| OEM | Logitech | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | Palomar 9000 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Machine type | — | High-speed fine wire wedge and ribbon bonder[2] |
| Bond head drive technology | — | Voice coil technology[2] |
| Wedge clamps | — | Interchangeable 45-60° and 90° deep access wedge clamps[2] |
| Work area | — | 304 x 152 mm[2] |
| Bond head motion note | — | The entire bond head mechanism rides on theta[2] |
| Bond head technology | — | Voice coil technology[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →