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Comparison ledger

15 LapperversusRR 700 L 150 Z 30

Lapmaster 15 Lapper, Rorze RR 700 L 150 Z 30, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMLapmasterRorze
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Rorze RR 700 L 150 Z 30
Cited variants—
  • RR700L150-Z30-01[1]
Specifications
Number Of Conditioning RingsUp to 3[2]—
Ring IDUp to 5.5″[2]—
Plate Diameter – Outside15″[2]—
Plate Diameter – Inside3 1/2″[2]—
Standard RPM60[2]—
Drive Motor1/2 HP[2]—
Electrics110V / 1Ph / 60Hz[2]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[2]—
ConfigurationEquipped with:[2]Single Arm, compatible with AMAT Mirra Mesa CMP[3]
Equipped with: 15″ Cast Iron PlateIncluded[2]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[2]—
Equipped with: (3) Conditioning RingsIncluded[2]—
Equipped with: (3) Hold DownsIncluded[2]—
Equipped with: 30 Minute TimerIncluded[2]—
Wafer size—6 inch[3]
Wafer size (alternate variant)—200mm[1]
Arm configuration—Single arm[3]
Compatible systems—AMAT Mirra Mesa CMP[3]
Application type—SMIF robot[1]
Wafer size (base model)—6 inch[3]
Robot type—Dry robot[4]
Manufacturer—Rorze[3]
Model—RR 700 L 150 Z 30[3]
Category—CMP[5]
Wafer handling size—200 mm[5]
Compatibility—AMAT Mirra Mesa CMP[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]tarasemi.comtarasemi.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]shop.entrepix.comshop.entrepix.com
  5. [5]waferpedia.comwaferpedia.com