Waferpedia

Comparison ledger

15 LapperversusDSS 200 Post

Lapmaster 15 Lapper, Ontrak DSS 200 Post, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMLapmasterOntrak
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Ontrak DSS 200
Cited variants—
  • Ontrak DSS200 Series 1[1]
  • Ontrak DSS200 Series 2[2]
Specifications
Number Of Conditioning RingsUp to 3[3]—
Ring IDUp to 5.5″[3]—
Plate Diameter – Outside15″[3]—
Plate Diameter – Inside3 1/2″[3]—
Standard RPM60[3]—
Drive Motor1/2 HP[3]—
Electrics110V / 1Ph / 60Hz[3]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[3]—
ConfigurationEquipped with:[3]With Hepa Mini-Environment[4]
Equipped with: 15″ Cast Iron PlateIncluded[3]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[3]—
Equipped with: (3) Conditioning RingsIncluded[3]—
Equipped with: (3) Hold DownsIncluded[3]—
Equipped with: 30 Minute TimerIncluded[3]—
Tool type—double-sided PVA scrubber[2]
Wafer size range—100mm to 200mm[1]
Throughput—45-65 wafers per hour[2]
Post-CMP cleaning applications—oxide, polysilicon, nitride, tungsten, aluminum and copper[2]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]axustech.comaxustech.com
  2. [2]axustech.comaxustech.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing