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Comparison ledger

15 LapperversusPM 2 Surface Polishing

Lapmaster 15 Lapper, Logitech PM 2 Surface Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMLapmasterLogitech
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Logitech PM 2 Surface Polishing
Specifications
Number Of Conditioning RingsUp to 3[1]—
Ring IDUp to 5.5″[1]—
Plate Diameter – Outside15″[1]—
Plate Diameter – Inside3 1/2″[1]—
Standard RPM60[1]—
Drive Motor1/2 HP[1]—
Electrics110V / 1Ph / 60Hz[1]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[1]—
ConfigurationEquipped with:[1]110 Volts[2]
Equipped with: 15″ Cast Iron PlateIncluded[1]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[1]—
Equipped with: (3) Conditioning RingsIncluded[1]—
Equipped with: (3) Hold DownsIncluded[1]—
Equipped with: 30 Minute TimerIncluded[1]—
Frequency—60 Hz[3]
Power & electrical—110 Volts[3]
Phase—Single phase[3]
Current—3 Amps[3]
Asset #—142902[2]
Make—Logitech[2]
Model—PM 2[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com