Waferpedia

Comparison ledger

12 Lapperversus700

Lapmaster 12 Lapper, Lapmaster 700, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
700Lapmaster
OEMLapmasterLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Lapmaster 700
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]—
Phase1[1]—
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
Machine type—Air Bearing Optical Polishing Machine[3]
Configuration—ring lap, planetary configuration[3]
Form factor—precision floorstanding machine[3]
Intended application—polishing of high precision plano optics[3]
Supported materials—glass, glass ceramic, or crystalline material[3]
Optical polishing pitch plate diameter—700 mm (27.5 in)[3]
Workholder rings—2 + 1 aluminum glass-faced workholder rings, each with an internal diameter of 224 mm (8.8 in)[3]
Drive to support plate—flat multi "V" belt running around the outside edge of the support plate[3]
Main drive motor—totally enclosed, fan cooled, 1.5 kW motor mounted on rails to allow belt adjustment[3]
Electrical service—460 volts, 60 Hz, 3 phase[3]
Machine Type—Air Bearing Optical Polishing Machine (ring lapper / planetary configuration)[3]
Support Plate Diameter—700 mm (27.5 in)[3]
Workholder Rings (Quantity & Internal Diameter)—3 aluminum glass-faced rings, each 224 mm (8.8 in) internal diameter[3]
Drive Type—Flat multi-V belt running around outside edge of support plate[3]
Main Drive Motor Power—1.5 kW[3]
Electrical Service—460 V, 60 Hz, 3 phase[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]web.archive.orgweb.archive.org