Comparison ledger
Lapmaster 12 Benchtop Lapping Polishing, Logitech EP1, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | EP1Logitech |
|---|---|---|
| OEM | Lapmaster | Logitech |
| Category | CMP | CMP |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 12 Benchtop Lapping Polishing | Logitech EP1 |
| Specifications | ||
| Make | Lapmaster[1] | — |
| Model | 12[1] | — |
| Category | CMP[2] | — |
| Type/Application | Single sided[3] | — |
| Plate diameter | 12 in[3] | — |
| No. of conditioning rings | 3[4] | — |
| Configuration | Ring lapper[4] | — |
| Base | Rigid, lightweight, cast aluminum base[4] | — |
| Standard RPM | 60 RPM[4] | — |
| RPM range with variable speed drive | 0-60[4] | — |
| Drive motor - lapper | 0.5 HP[4] | — |
| Drive motor - polisher | 0.75 HP[4] | — |
| Length | 25 in[4] | — |
| Width | 18 in[4] | — |
| Height | 24 in[4] | — |
| Estimated shipping weight | 240 lbs[4] | — |
| Approximate weight | 135 lbs / 61 kg[5] | — |
| Approximate dimensions | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[5] | — |
| Electrical system | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[5] | — |
| Motor | 1/3 hp / 0.25 kW motor with gear reducer[5] | — |
| Abrasive feed system | Designed for water or oil based lapping slurries[5] | — |
| Automatic cycle timer | Automatic digital cycle timer[5] | — |
| Ring configuration | Ring lapper[4] | — |
| Ring ID | 4.25 inches[4] | — |
| Product family | — | EP Polishing Pads and Cloths[6] |
| Application type | — | Chemical Mechanical Polishing (CMP)[6] |
| Suitable applications | — | oxide, nitride and copper[6] |
| Type | — | Chemical Mechanical Polishing (CMP) cloths and pads[6] |
| Suitable materials | — | Oxide, nitride and copper[6] |
| Product type | — | Chemical Mechanical Polishing (CMP) polishing cloths and pads[6] |
| Applications | — | oxide, nitride, and copper[6] |
| Associated wafer process capacity | — | up to 100mm/4"[7] |