Waferpedia

Comparison ledger

AutoEtch 590versus1512e

Lam Research AutoEtch 590, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
AutoEtch 590Lam Research
1512eTegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research AutoEtch 590Tegal 1512e
Specifications
ConfigurationCassette-to-cassette automatic plasma etching platform[1]—
Chamber structureDouble airlock chamber structure[1]—
Plasma configurationParallel plate plasma etching configuration[1]—
Wafer handlingAutomatic cassette-to-cassette wafer handling; single wafer plasma etch processing platform[1]—
Control systemUpgraded Allwin21 PC controller and touchscreen monitor[1]—
Programmable parametersRF power, chamber pressure, gas flow control, electrode spacing, multi-step process recipes[1]—
OEMLam Research[2]—
ModelAutoEtch 590[2]—
Equipment typeEtcher[2]—
Wafer size4"~6"[1]—
Process platformSingle wafer plasma etch processing platform[1]—
Control interfaceAllwin21 upgraded PC controller and industrial touchscreen monitor interface[1]—
Process parametersProgrammable RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes[1]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]Equipment inventory listing
  3. [3]semistarcorp.comsemistarcorp.com