Waferpedia

Comparison ledger

839 800327 315 ESCversus100 ICP Fluorine

Lam Research 839 800327 315 ESC, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
839 800327 315 ESCLam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research 839 800327 315 ESCOxford Instruments 100 ICP Fluorine
Specifications
ConfigurationLam 2300 300mm Etch Flex Talon ECT[1]—
ManufacturerLam Research[3]—
CategoryEtch[3]—
Designation839 800327 315 ESC[3]—
Associated toolLam 2300 300mm Etch Flex Talon ECT[2]—
Wafer size300mm[1]4 inch, 6 inch, 8 inch (with clamp change)[4]
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[4]
Cryo DRIE etch rate—up to 5 µm/min[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]nanofab.utah.edunanofab.utah.edu