Comparison ledger
Lam Research 2300, Oxford Instruments Plasmalab 80 Plus RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300Lam Research | Plasmalab 80 Plus RIEOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | 8" | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Oxford Instruments Plasmalab 80 |
| Cited variants | — | |
| Specifications | ||
| 3 Chambers | Insulating Film, Metal, Ashing[1] | — |
| Wafer size | Wafer set up for 8"[1] | Small piece of wafer until max full 8 inches wafer[5] |
| Configuration | With Exelan Flex 45 Dielectric Etch Chamber[1] | 50/60 Hz[4] |
| Wafer sizes supported | 8 inch, 12 inch[1] | — |
| Chamber configuration | 3 chambers: Insulating Film, Metal, Ashing[1] | — |
| Wafer setup | Wafer set up for 8 inch[1] | — |
| Dielectric etch chamber | Exelan Flex 45 Dielectric Etch Chamber[1] | — |
| Included subsystems | HDD & Software included; all pumps, generators & other subsystems included[1] | — |
| CE Mark | CE Mark 2023 Vintage[1] | — |
| Configuration (12-inch) | KIYO EXP MRT[2] | — |
| OEM | Lam Research[1] | — |
| Model | 2300[1] | — |
| Category | Etch[1] | — |
| Wafer sizes | 8 inch, 12 inch[1] | — |
| Voltage | — | 415 VAC, 3 Phase[4] |
| Full Load Amps | — | 25.6 A[4] |
| Max Flow Rate Per Gas | — | 100 sccm[4] |
| RF Generator | — | 300 Watt 13.56 MHZ[4] |
| Table | — | Cool Down Only (No Heating)[4] |
| Typical Process Pressure | — | 30 - 100 Mtorr[4] |
| Pumping System | — | Corrosion Resistant Turbo Molecular Pump with Rotary Pump[4] |
| Available Gases in Chamber | — | Ar, CF4, O2, CHF3, SF6, & He[4] |
| Phase | — | 3 Phase[5] |
| Available gas in the chamber | — | Ar, CF4, O2, CHF3, SF6 & He.[5] |
| RF generator | — | 300 Watt 13.56MHz[5] |
| Typical process pressure | — | 30 – 100 mtorr[5] |
| Pumping system | — | Corrosion-resistant turbo-molecular pump with rotary pump[5] |
| Uniformity | — | 5 - 10 % range[6] |
| Chamber Gases | — | Ar, CF4, O2, CHF3, SF6, He[4] |
| Table Type | — | Cool down only (no heating)[4] |
| Wafer Size | — | Small piece of wafer up to full 8 inches[5] |
| Frequency | — | 50/60 Hz[4] |
| Available Gases | — | Ar, CF4, O2, CHF3, SF6, He[4] |
| Wafer Sizes Supported | — | 2, 3, 4, 5, 6, 8 inch[5] |
| Dual Chamber Configuration | — | Available on some units[6] |
| PECVD Capability | — | 9 inch plate, tested for 2-4 inch wafers[6] |
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