Comparison ledger
Kulicke & Soffa 3600 Plus, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3600 PlusKulicke & Soffa | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Kulicke & Soffa | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kulicke & Soffa 3600 Plus | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Model | 3600 Plus[1] | — |
| Asset # | 74055[1] | — |
| Description | Wire Bonder[1] | — |
| Category | Packaging & Bonding[2] | — |
| Wire diameter range | 125 to 625 microns[4] | — |
| Z travel | 50 mm[3] | — |
| Theta travel | +/- 220°[3] | — |
| Focus | 30 mm (Programmable Range)[3] | — |
| Monitor | Flat Panel, 17"[3] | — |
| Transducer | 60/80 kHz[3] | — |
| Forcer | 50 - 1500 gr[3] | — |
| Wire range | 100 to 500 μm[3] | — |
| Maximum wire looping | 40.0 mm[3] | — |
| Die rotation | +/- 70°[3] | — |
| Pattern recognition type | Enhanced OE GS III[3] | — |
| Connectivity | Ethernet, USB[3] | — |
| Storage | Hard Disk Drive (HDD)[3] | — |
| Footprint | 680 mm x 1308 mm[3] | — |
| Certification | CE Certification[3] | — |
| Operating system | VX Works and Windows XP[3] | — |
| Power consumption | 5 A at 230 V[3] | — |
| Power requirement | 180-240 VAC, Single Phase, 50/60 Hz[3] | — |
| Bond area X | 250 mm[3] | — |
| Bond area Y | 150 mm[3] | — |
| Manufacturer | Kulicke & Soffa (K&S)[3] | — |
| Wafer Size | — | 6 inch[5] |
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