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Comparison ledger

EM TIC 3 Xversus12 Benchtop Lapping Polishing

KLA EM TIC 3 X, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMKLALapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA EM TIC 3 XLapmaster 12 Benchtop Lapping Polishing
Specifications
Wafer size8 inch[1]—
Make—Lapmaster[2]
Model—12[2]
Category—CMP[3]
Type/Application—Single sided[4]
Plate diameter—12 in[4]
No. of conditioning rings—3[5]
Configuration—Ring lapper[5]
Base—Rigid, lightweight, cast aluminum base[5]
Standard RPM—60 RPM[5]
RPM range with variable speed drive—0-60[5]
Drive motor - lapper—0.5 HP[5]
Drive motor - polisher—0.75 HP[5]
Length—25 in[5]
Width—18 in[5]
Height—24 in[5]
Estimated shipping weight—240 lbs[5]
Approximate weight—135 lbs / 61 kg[6]
Approximate dimensions—24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[6]
Electrical system—Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[6]
Motor—1/3 hp / 0.25 kW motor with gear reducer[6]
Abrasive feed system—Designed for water or oil based lapping slurries[6]
Automatic cycle timer—Automatic digital cycle timer[6]
Ring configuration—Ring lapper[5]
Ring ID—4.25 inches[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]lapmaster-wolters.comlapmaster-wolters.com
  5. [5]catalog.lapmaster.comcatalog.lapmaster.com
  6. [6]lapmaster-wolters.comlapmaster-wolters.com