Comparison ledger
KLA .204 PSL Wafer, Koh Young 3D, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3DKoh Young | |
|---|---|---|
| OEM | KLA | Koh Young |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA .204 PSL Wafer | Koh Young 3D |
| Cited variants | — | |
| Specifications | ||
| Configuration | NIST Traceable[4] | — |
| Wafer Size | 8 inch[4] | — |
| Traceability | NIST[5] | — |
| Compatible Tools | Surfscan 6xy0, Sp1[4] | — |
| NIST Traceable | Yes[4] | — |
| Technology | — | Patented True 3D technology[1] |
| Inspection method | — | True profilometric 3D volume measurement[1] |
| Inspected items | — | Components, solder joints, patterns, and foreign material on assembled PCBs[1] |
| Inspection standard | — | IPC-610 / IPC-A-610 based solder-joint inspection[1] |
| Camera feature | — | Full 3D coverage with powerful side-view camera[1] |
| Auto-programming | — | AI-powered Auto-Programming (KAP)[1] |
| Self-diagnosis | — | Modules for periodic checks of 3D/2D light intensity, PZT feed, height accuracy, and XY offset[1] |
| Process control | — | KSMART Solutions: True 3D measurement-based process control system[1] |
| Process optimization | — | Koh Young Process Optimizer (KPO) for mounter[1] |
| Inspection speed (KY8030-2) | — | 11.1 to 59.5 cm²/sec[2] |
| Paste height (KY8030-2) | — | 450 microns[2] |
| Resolution options (KY8030-2) | — | 10, 15, 20, 25 microns[2] |
| Throughput (KY8030-3 and USX) | — | Up to 81.85 cm²/sec at 8 megapixel and 20 microns[2] |
| Inspection height (KY8030-3) | — | 400 microns[2] |
| Z resolution (KY8030 USX) | — | 0.37 microns[3] |
| Height accuracy (KY8030 USX) | — | 1 micron[3] |
| Max board length (USX) | — | 1,300 mm standard, optionally 1,800 mm[3] |
| Additional materials (KY8030-3) | — | Conductive glue, sinter paste[2] |
| AOI measurement capability (Zenith series) | — | Profilometric shape of components, solder joints, patterns, foreign material[1] |
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