Waferpedia

Comparison ledger

1088versus1700EXL

Heller 1088, Heller 1700EXL, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
1700EXLHeller
OEMHellerHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088Heller 1700EXL
Cited variants—
  • Heller 1500EXL[1]
  • Heller 1800EXL[1]
  • Heller 1900EXL[1]
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[2]—
Heating MethodForced convection[2]—
Conveyor Width18 inches (45 cm)[2]—
Heated Length43.5 inches (111 cm)[2]—
Overall Length96 inches (244 cm)[2]—
Height50 inches (127 cm)[2]—
Net Weight900 lbs (409 kg)[2]—
Thermal ProfilerIncluded[2]—
Oven TopCounter balance for easy access to conveyor[2]—
Solder CompatibilityLead-free and leaded soldering[2]—
Series—EXL Series[1]
Heating zones—Six heating zones[1]
Cooling zones—One internal cooling zone[1]
Profiling—Five thermocouple profiling[1]
Maximum line speed—Up to 32 inches (80 cm) per minute[1]
Control software—Enhanced Windows-based software[1]
Integrated profiling—Integrated KIC thermal profiling[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]smtdevices.comsmtdevices.com