Comparison ledger
EV Group 850 SOI Wafer, SUSS MicroTec SB8E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 850 SOI WaferEV Group | SB8ESUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | Windows NT |
| Generation | — | — |
| Family | EV Group 850 | SUSS MicroTec SB8E |
| Specifications | ||
| Configuration | Fully-Automatic[1] | — |
| Wafer size | Suitable for wafer sizes up to 6"/150mm wafers[1] | — |
| Manufacturer | EV Group[2] | — |
| Model | 850 SOI Wafer[1] | — |
| Category | Packaging & Bonding[2] | — |
| Operating mode | Fully-Automatic[1] | — |
| Maximum wafer size | up to 6"/150mm wafers[1] | up to 150mm[4] |
| Current configuration | configured for 6"/150mm wafers[1] | — |
| Robot | One Genmark Robot with pre-aligner[1] | — |
| Cleaning modules | Two Cleaning Modules[1] | — |
| Bonding station | One bonding station with high vacuum[1] | — |
| Pre-aligner | Mechanical pre-aligner on bond station (pneumatically actuated)[1] | — |
| Control interface | PC controlled with Windows-based graphical user interface[1] | — |
| Access control | Password protected access levels[1] | — |
| Cleaning control | Programmable rotational speed for substrate cleaning[1] | — |
| Cleaning option | Megasonic cleaning option[1] | — |
| Vintage | 2000[3] | — |
| Tool type | — | VAC substrate bonder[4] |
| Vacuum level | — | down to 5x10e-5 mbar[4] |
| Overpressure | — | up to 3 bar[4] |
| Bonding processes | — | Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding, Thermal Compression Bonding[4] |
| Heating | — | Double-side heating up to 550 Degrees Celsius[4] |
| Power supply | — | 0 to +/- 2000 VDC with maximum current at 15mA[4] |
| Control software platform | — | Windows NT[4] |
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