Comparison ledger
EV Group 520, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 520EV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 520 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Phase | 3 Phase[1] | — |
| Wafer size | Manual wafer load substrate bonder[1] | — |
| Wafer Size | up to 150 mm capable[1] | 6 inch[2] |
| Vacuum Chuck | 6"/150mm diameter chuck[1] | — |
| Max Bond Force | 7 kN[1] | — |
| Top Side Heater | 550°C max. in 1°C steps[1] | — |
| Bottom Side Heater | 550°C max. in 1°C steps[1] | — |
| Temperature uniformity | ± 1,5 %[1] | — |
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