Comparison ledger
EV Group 101, Tokyo Electron Mark 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | Mark 8Tokyo Electron |
|---|---|---|
| OEM | EV Group | Tokyo Electron |
| Category | Lithography | Lithography |
| Wafer size | — | Parallel wafer flow processing software option (simultaneous coat & develop) |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1992 Vintage · 1993 Vintage · 1996 Vintage · 1998 Vintage |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Tokyo Electron Mark |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[6] | — |
| Model | 101[6] | Mark 8[4] |
| Equipment name | EVG 101 Spray Coater[6] | — |
| NEMO ID | evgspraycoat[6] | — |
| Training required | EVG 101 Training[6] | — |
| Training duration | 1.50 hours[6] | — |
| Processing technique | Resist Spray Coat (manual)[6] | — |
| Cleanliness | "All"[6] | — |
| Location | SNF Paul G Allen L107 Cleanroom[6] | — |
| Wafer diameter (substrate size) | up to 300 mm[7] | — |
| Available modules | Spin coat / OmniSpray® / develop[7] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[7] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[7] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[8] | — |
| Cleanliness group (at SNF) | "All"[6] | — |
| Configuration | — | SOGT[3] |
| Wafer size | — | Parallel wafer flow processing software option (simultaneous coat & develop)[4] |
| Wafer Size | — | 6 inch, 8 inch[1] |
| Configurations | — | Developer, Coater, Coater/Developer[1] |
| Vintages | — | 1992, 1993, 1996, 1998[2] |
| Coater/Developer Configuration Details | — | 2 coater / 2 developer - Cassette platforms (4) - Coat Modules (2) - Hot Plates (8) - Chill Plates (9) - Wash Disk system (WDS) - A two block system / two robots - Parallel wafer flow processing software option (simultaneous coat & develop) - Semifab CD 200+4TEL Temperature & Humidity Unit - Chemical cabinet containing SMC INR-244-117B Thermocons[4] |
| Make | — | Tel[4] |
| Wafer sizes | — | 6 inch[2] |
| Cassette platforms | — | 4[4] |
| Coat modules | — | 2[4] |
| Hot plates | — | 8[4] |
| Chill plates | — | 9[4] |
| Wash disk system | — | WDS[4] |
| Robots | — | 2[4] |
| Software option | — | Parallel wafer flow processing software option (simultaneous coat & develop)[4] |
| Temperature & humidity unit | — | Semifab CD 200+4TEL Temperature & Humidity Unit[4] |
| Chemical cabinet contents | — | SMC INR-244-117B Thermocons[4] |
| Bulk developer chemical mix station | — | Available for this system[4] |
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