Waferpedia

Comparison ledger

2008 HLversus10490

Esec 2008 HL, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMEsecWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—West Bond 10490
Specifications
Manufacturer—West Bond[1]
Model—10490[1]
Description—Convertible bonder, wedge to ball[2]
Tool type—Convertible bonder[3]
Bonding modes—Wedge bonding and ball bonding[3]
Use—Wire bonding[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]waferpedia.comwaferpedia.com