Comparison ledger
Disco dad3240-dicing-saw, SUSS MicroTec XB8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | dad3240-dicing-sawDisco | XB8SUSS MicroTec |
|---|---|---|
| OEM | Disco | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco dad3240-dicing-saw | SUSS MicroTec XB8 |
| Specifications | ||
| vendor | Disco[1] | — |
| model | DFL7340[1] | — |
| process area | Packaging[1] | — |
| compatible materials | Si wafers only[1] | — |
| engine | SDE03 engine with λ = 1342 nm[1] | — |
| maximum sample diameter | 200 mm[1] | — |
| dicing orientation | Topside or backside (through tape) dicing possible[1] | — |
| Wafer size (max) | — | 200 mm[2] |
| Automation | — | Semi-automated[2] |
| Process | — | High-Force Wafer Bonding[2] |
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