Comparison ledger
Disco 321, Disco DAD3221, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DAD3221Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DAD3221 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | Automatic dicing saw[4] |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | non-contact setup[4] |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Type | — | automatic dicing saw[4] |
| Wafer size | — | 100, 150 mm wafers[4] |
| Blade monitoring | — | blade breakage detector[4] |
| Cutting functions | — | circle cut for edge trimming or down sizing[4] |
| Particle/ESD mitigation | — | CO2 injector to prevent particle adhesion and electrostatic discharge damage[4] |
| Alignment aids | — | pattern recognition system; automatic micro-alignment[4] |
| Wafer / substrate size | — | 100, 150 mm wafers[4] |
| Substrate size | — | up to 150mm diameter[5] |
| Max. workpiece size | — | Φ6 inch (150 mm × 150mm user-specified specification)[6] |
| Non-contact setup | — | Yes[4] |
| Blade breakage detector | — | Yes[4] |
| Circle cut | — | For edge trimming or downsizing[4] |
| CO2 injector | — | Prevents particle adhesion and electrostatic discharge damage[4] |
| Pattern recognition system | — | Yes[4] |
| Automatic micro-alignment | — | Yes[4] |
| Spindle layout | — | Single[6] |
| Standard rated output | — | 2.0 kW at 40,000 min-1[6] |
| Optional rated output | — | 1.8 kW at 60,000 min-1[6] |
| Equipment dimensions | — | 490 × 870 × 1,670 mm[6] |
| Equipment weight | — | Approx. 420 kg[6] |
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