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Comparison ledger

DiscoveryversusDiscovery 18versusDiscovery Cathode

Denton Vacuum Discovery, Denton Vacuum Discovery 18, Denton Vacuum Discovery Cathode, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DiscoveryDenton Vacuum
Discovery 18Denton Vacuum
Discovery CathodeDenton Vacuum
OEMDenton VacuumDenton VacuumDenton Vacuum
CategoryDepositionDepositionDeposition
Wafer size—6-inch diameter stage—
Process node———
Introduced———
Production run———
Lifecycle———
Lifecycle milestones———
Control system———
Generation———
FamilyDenton Vacuum DiscoveryDenton Vacuum DiscoveryDenton Vacuum Discovery
Cited variants
  • Discovery 200[1]
  • Discovery 300[1]
  • Discovery V[1]
  • Discovery I[1]
  • Discovery 635[2]
  • Discovery 785[2]
——
Specifications
ConfigurationWith Lipon Deposition[3]—12.0" sputtering system with planetary Load lock and robot loading assemblies[7]
TechnologyMagnetron sputtering[4]——
Substrate Size (Discovery 200)Up to 200 mm[1]——
Substrate Size (Discovery 300)Up to 300 mm[1]——
Cathode Configuration (Discovery 200)Up to four 4" diameter confocal sources[1]——
Cathode Configuration (Discovery 300)Up to three 6" diameter confocal sources[1]——
Power SupplyDC, RF, Pulsed DC[1]——
VacuumCryo/Turbo[1]——
Substrate BiasRF bias with dedicated power supply and auto matching network[1]——
Plasma Emission MonitorYes (Discovery 200/300), No (Discovery V), Yes (Discovery I)[1]——
Coating Uniformity (Discovery 200/300)< +/-5%[1]——
Coating Uniformity (Discovery V)< +/-2%[1]——
Coating Uniformity (Discovery I)< +/-0.25%[1]——
Deposition type—Sputter deposition of metals, alloys, and insulating thin films[5]—
Film thickness range—From a few nm to hundreds of nm[5]—
Cathodes—Three 3-inch diameter confocal cathodes[5](4) 12" Cathodes[7]
RF power supplies—2 RF power supplies[5]—
DC power supply—Switchable DC power supply[5]—
Co-sputter capability—Yes[5]—
Reactive sputtering—Available with nitrogen or oxygen[5]—
Stage diameter—6-inch diameter stage[5]—
Substrate rotation uniformity—+/- 10%[5]—
Pump system—Cryo and turbo pumped[5]—
Base pressure—1 x 10^7 Torr[5]—
Substrate heating—Up to 200 C[5]—
Liftoff deposition—Available with sputter power[5]—
Argon pressure range—3-15 mT controllable with 200 sccm MFC controller[5]—
Number of cathodes—3[5]—
Cathode diameter—3 inches[5]—
Co-sputtering capability—Yes[5]—
Substrate rotation—Yes[5]—
Uniformity—+/- 10%[5]—
Pumping system—Cryo and turbo pumped[5]—
MFC controller—200 sccm (no APC valve)[5]—
Deposition technique—Sputter deposition of metals, alloys, and insulating thin films (user configurable)[5]—
Film thickness control—Controllable from a few nm to hundreds of nm[5]—
Power supplies—2 RF power supplies; switchable DC power supply[5]—
Substrate stage size—6-inch diameter stage[5]—
Chamber material—304L SS, 18" Diameter x 13.5" Deep[6]—
Baseplate material—304L SS, 20" Diameter[6]—
High vacuum pump—140 l/s Turbomolecular Pump[6]CTI Cryogenics High Vacuum Pump/Blanket Heater[7]
Mechanical pump—11 cfm[6]—
Control cabinet—Single 19" Standard EIA Rack, with Single Point Power Connection[6]—
High vacuum gauge—Digital Cold Cathode Auto-Ranging[6]—
Control type—PLC Control of Auto Pump Sequence[6]—
Feedthroughs—Baseplate (15) 1.0", (2) 2.75" Conflats, (2) 1.33" Conflats[6]—
Floor space—96" Wide x 48" Deep[6]—
Chamber viewpoints—(1) 4.0" Diameter High Vacuum Valve Horizontal, 5.75" Diameter Bellows Sealed[6]—
Sputtering system size——12.0 inch[7]
Chamber dimensions——Approx. 4' X 6' X 12" Stainless Steel Chamber[7]
Ion source——Veeco 5 cm Gridded Ion Source with Gas Controls[8]
Cryopump——Torr400 Cryopump with Oxford E500 Dual Temperature Monitor[7]
Turbo molecular pump——KYKY F400 Turbo Molecular Pump with FV-LII Pump Controller[7]
Compressor——CTI-Cryogenics 9600 Compressor[7]
DC power supplies——(4) Advance Energy Pinnacle plus DC Power Supplies[8]
Robot——Loader/Unloader with Epson G6-453c Robot, Vintage 9/10[7]
Controller——Ion Tech Mps-3000 fc Controller[7]
Load lock——Load Lock Loader with PLC Controller[7]
Gate valve——Vat Gate Valve[7]
Adaptive pressure controller——Vat Adaptive Pressure Controller[7]
Pressure monitors——Assorted Pressure Monitors[7]
Isolation valves——Isolation Valves[7]
Power supply/control——Stand Alone Power Supply/Control[7]
Computer system——Computer System with Related Hardware/Software[7]
Manufacturer——Denton Vacuum[7]
Model——Discovery Cathode[7]
Category——Deposition[8]
Process type——Sputtering system[8]
Wafer size——12.0-inch[8]
Wafer handling——Planetary load lock and robot loading assemblies[8]
Chamber——Approx. 4' x 6' x 12" stainless steel chamber[7]
Vacuum pumps——CTI Cryogenics high vacuum pump/blanket heater; Torr400 cryopump with Oxford E500 dual temperature monitor; KYKY F400 turbo molecular pump with FV-LII pump controller[7]
Pressure control——Vat gate valve and Vat adaptive pressure controller[7]
Control system——Ion Tech Mps-3000 fc controller; stand alone power supply/control; computer system with related hardware/software[7]
Robot loader/unloader——Epson G6-453c robot[7]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]info.dentonvacuum.cominfo.dentonvacuum.com
  2. [2]info.dentonvacuum.cominfo.dentonvacuum.com
  3. [3]inventory listing
  4. [4]dentonvacuum.comdentonvacuum.com
  5. [5]nanofab.utah.edunanofab.utah.edu
  6. [6]web.archive.orgweb.archive.org
  7. [7]inventory listing
  8. [8]waferpedia.comwaferpedia.com