Comparison ledger
Datacon 2200, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2200Datacon | 10490West Bond |
|---|---|---|
| OEM | Datacon | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | 1995 | — |
| Production run | 1995– | — |
| Lifecycle | — | — |
| Lifecycle milestones | 1995 Platform introduction | — |
| Control system | — | — |
| Generation | — | — |
| Family | Datacon 2200 | West Bond 10490 |
| Cited variants |
| — |
| Specifications | ||
| Product type | Multi Chip Die Bonder[1] | — |
| Platform basis | Based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform[1] | — |
| System description | Revolutionary modular system[1] | — |
| Flexibility | Extraordinary flexibility with minimum space requirements[1] | — |
| Application conversion | Conversion between different applications is done fast and simply[1] | — |
| Developed for | Demanding advanced packaging market[1] | — |
| Features & highlights | Automatic Tool Changer System; Automatic Wafer Handling System; Flip Chip Unit; Needle Ejector System; Processing of Epoxy, Flux and Solder Paste; Software Features & Options; Tape Feeder[1] | — |
| Connection technologies | Flip chip, die attach, or combination[1] | — |
| Automatic Tool Changer System | Feature included[1] | — |
| Automatic Wafer Handling System | Feature included[1] | — |
| Flip Chip Unit | Feature included[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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