Comparison ledger
CEE 1000 Hot Plate, Heller 1809 MK III, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1809 MK IIIHeller | |
|---|---|---|
| OEM | CEE | Heller |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | Heller 1809 |
| Specifications | ||
| Configuration | 4"[1] | 50/60 Hz[2] |
| Type | Hot Plate[1] | — |
| Wafer Size | 4 inch[1] | — |
| Voltage | — | 220 V[2] |
| Largest Heater Load | — | 13 A[3] |
| Short Circuit interrupting Capacity | — | 5000 A[3] |
| Equipment type | — | Reflow oven[2] |
| Electrical specification | — | 50/60 Hz, 220 V[2] |
| Control system | — | Windows 8.1[3] |
| Option | — | Includes edge rail support option[3] |
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