Waferpedia

Comparison ledger

1000 Hot Plateversus1707 EXL

CEE 1000 Hot Plate, Heller 1707 EXL, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1707 EXLHeller
OEMCEEHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateHeller 1707
Specifications
Configuration4"[1]208 / 240 V[2]
TypeHot Plate[1]—
Wafer Size4 inch[1]—
Breaker Size—100 Amp at 480 V[2]
Largest Heater Load—02 A[2]
Short Circuit Interrupting Capacity—5000 A[2]
Windows Operating System—Windows XP[2]
Heater Type—Instant response Open Coil[2]
Heater Material—Nichrome[2]
Profile change Time—5 - 15 minutes[2]
Insulation Type—Calcium Silicate[2]
Number of Cooling Zones Standard—1[2]
Model—1707 EXL[2]
Category—Thermal / Diffusion[3]
Heating zones—7 top, 7 bottom[4]
Cooling zones—1 standard[4]
Operating system—Windows XP[2]
Power input—3-phase 208/240 VAC standard[5]
Breaker size—100 A @ 480 V[5]
Optional power inputs—380/400/415/480 VAC[5]
Frequency—50/60 Hz[2]
Temperature range—25-350°C standard[5]
High-temperature option—Up to 450°C[5]
Max conveyor speed—24 inches/minute (60 cm/min)[5]
Board width—2 inches to 20 inches (5-51 cm)[5]
Recipe storage—Up to 500 temperature recipes and 500 profile graphs[4]
Nitrogen consumption—As low as 700 SCFH; typical 700-900 SCFH[4]
Dimensions—134 x 54 x 63 in (340 x 137 x 160 cm)[5]
Typical net weight—3000 lbs (1360 kg)[5]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]efsmt.comefsmt.com
  5. [5]tengdasmt.comtengdasmt.com