Waferpedia

Comparison ledger

11000versusEG 4090 u Automatic Wafer

Cascade Microtech 11000, Electroglas EG 4090 u Automatic Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11000Cascade Microtech
OEMCascade MicrotechElectroglas
CategoryTest & ProbeTest & Probe
Wafer size—Wafer Profiler Kit
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCascade Microtech 11000Electroglas EG 4090
Cited variants—
  • Electroglas EG 4090 u Automatic Wafer Prober[1]
Specifications
ConfigurationWith antivibration table[2]For Parts[4]
Temperature Range—Ambient ~ +130 degree C[1]
Wafer size—Wafer Profiler Kit[1]
Voltage—220VAC, 50 / 60 Hz & Single Phase Input Voltage[1]
Type—Automatic Wafer Prober[5]
Wafer Stage Size—8 inch X-Y Stage[1]
Hot Chuck Size—8 inch Standard Hot Chuck Top Assy[1]
Hot Chuck Temperature Range—Ambient ~ +130°C[1]
Vision Module—Dual Optic Bridge CCD Camera Assembly[1]
Wafer Profiler Kit—Included[1]
Ring Carrier Plate—RC 2[1]
Probe Card Holder—RTGR 2[1]
Cassette Loader—Right Side Single Cassette Loader[1]
Control Module—Display Control Module with Windows EGC Version 7 or Higher[1]
Display—LCD Touch Screen Monitor[1]
Z-Stage—PZ 7 Z-Stage, 0.125 MIL or 0.25 MIL Z Resolution[1]
Alignment—PTPA (Probe to Pad Alignment), PTPO[1]
Interfaces—RS 232, GPIB & TTL Tester Interface[1]
Input Voltage—220VAC, 50/60 Hz, Single Phase[1]
Scrub Pad—Included[1]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing