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Comparison ledger

2000 iW+ Ultrasonic Welderversus1 WBS 1 Wafer Substrate

Branson 2000 iW+ Ultrasonic Welder, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMBransonLogitech
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 2000Logitech 1 WBS 1 Wafer Substrate
Cited variants—
Specifications
202.2[2]—
EPD101-162-115[2]—
ConfigurationBranson CJ 20 Transducer Converter:[2]—
EDP101-135-059[2]—
Diameter1 inch[2]—
Max BoosterGold[2]—
TypeSelf-contained ultrasonic plastics assembly system[1]—
Frequency20 kHz[1]—
Output power1100, 2200, or 3300 watts[1]—
Operating modesIW+ models give choice of time or distance modes, including collapse or absolute[1]—
FunctionsWelding, staking, insertion, swaging, spot welding, degating, cutting and sealing[1]—
Stroke length4 in (102 mm)[1]—
Power supply / system configurationPower supply module, process controls, and welding stand in a compact bench unit[1]—
ActuationPneumatic[4]—
Pneumatic cylinder size1.5, 2.0, 2.5, or 3.0[4]—
Data interfaceUSB, Ethernet[4]—
Wafer Size—6 inch[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]branson.emerson.combranson.emerson.com
  2. [2]inventory listing
  3. [3]sonitek.comsonitek.com
  4. [4]mingautotek.commingautotek.com
  5. [5]Equipment inventory listing