Waferpedia

Comparison ledger

22 AD 42versusR07

Blanchard 22 AD 42, Disco R07, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
R07Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—up to Φ8”
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco R07
Cited variants—
  • R07-SDC600-BB101-75[1]
  • R07-SD400-BB200-75[1]
  • R07-SDC400-BB300-75[1]
  • R07-SDC400-BB500-75[1]
Specifications
Phase3 Phase[2]—
Frequency60 Hz[2]—
Voltage120 Vac[2]—
ConfigurationNo coolant tank[2]—
Model—DAD3241[3]
Max. workpiece size—Φ8”[3]
X-/Y-axis cutting range—210 mm[3]
Cutting speed—0.1-800 mm/s[3]
Index positioning accuracy—0.002/210 mm[3]
Z-axis max. stroke—32.2 mm[3]
Moving resolution—0.000002 mm[3]
Repeatability accuracy—0.001 mm[3]
Θ-axis max. rotating angle—320°[3]
Rotation speed range—6,000-60,000 rpm[3]
Spindle power—1.8 kW[3]
Type—Resin bond blades[1]
Applications—Glass, quartz, ceramics, etc.[1]
Major uses—Glass (borosilicate glass, non-alkali glass), crystal, ceramics, QFN, metal, quartz, alumina, LTCC, aluminum nitride[1]
Wafer size—up to Φ8”[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]inventory listing
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu