Comparison ledger
Blanchard 20 36 Surface, Kulicke & Soffa 782-6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | 782-6Kulicke & Soffa |
|---|---|---|
| OEM | Blanchard | Kulicke & Soffa |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Kulicke & Soffa 782-6 |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | — |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Maximum wafer size | — | up to 6" wafers[2] |
| Maximum wafer thickness | — | 800 µm thick[2] |
| Materials diced | — | Si, Glass, Quartz, SiC, Sapphire, LiNbO3[2] |
| Kerf width | — | down to 50 µm (blade dependent)[2] |
| Blade cooling and rinsing | — | DI water[2] |
| Category | — | Dicing & Grinding[3] |
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