Comparison ledger
Blanchard 18 D Surface, Disco DGP 8760 + DFM 2800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | DGP 8760 + DFM 2800Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DGP 8760 |
| Specifications | ||
| Voltage | 416 V[1] | — |
| Phase | 3 Phase[1] | — |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[1] | — |
| Model | 18 D[1] | — |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[1] | 200 Vac, 3 Phase[3] |
| Configuration | — | Fully automatic[3] |
| Wafer Sizes | — | 8, 12 inch[3] |
| Fully automatic | — | Yes[3] |
| Inline UV irradiation system | — | Present[3] |
| Pre-Cut Dicing Tape | — | Yes[3] |
| Finish thickness min with wafer polishing | — | Up to 50ums[3] |
| Minimum finish thickness with wafer polishing | — | 50 µm[3] |
| Operation type | — | Fully automatic[3] |
| Configuration options | — | Stand-alone BG or in-line with wafer mounter[3] |
| Vintage year | — | 2009[3] |
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