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Comparison ledger

DS 9000 EversusUTC 1000

Besi DS 9000 E, Shinkawa UTC 1000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Packaging & Bonding, null[1]
Side-by-side comparison of selected equipment models
Attribute
UTC 1000Shinkawa
OEMBesiShinkawa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2005 Vintage
Control system——
Generation——
FamilyBesi DS 9000 EShinkawa UTC
Specifications
Voltage208 VAC[2]—
ConfigurationSingle Phase[1]Pattern Recognition Unit:[4]
Phase1 Phase[3]—
MakeBesi / Datacon[1]—
ModelDS 9000 E[1]—
Tool typeBonder[1]—
Wafer size8 inch[1]—
Frequency50/60 Hz[2]—
Current10 Amps[2]—
Bonding Method—Ultrasonic Thermo Compression[4]
Machine Accuracy—+/- 2.5 µm (+/- 3.3 µm for multi-bonding setting)[4]
Bonding Speed—67 ms / 2 mm Wire (With Loop Control)[4]
Bonding Wire Length—Max. 8 mm[4]
Number of Bonding Wires—8000 Wires[4]
Loader / Unloader—Magazine Stacker Type[4]
Indexer—Center-Parting Type Universal Indexer[4]
Power Supply—AC 100 V +/- 5 % 50/60 Hz[4]
Power Consumption—Approx. 1000 W[4]
Compressed Air—500 kPa {5 kgf / cm²} 60 I / min[4]
Vacuum pressure—-74 kPa (-550 mmHg) or less (Gauge Pressure)[4]
Dimensions & Mass—1080 W x 950 D x 1940 H mm , Approx. 590 kg[4]
Detection Method—Gray Scale Correlation[4]
Detection Speed—0.11 s Max,. / 2 Point Alignment (including move time)[4]
Lead Side—MAx. X: +/- 1.26 mm, Y: +/- 0.86 mm[4]
Die Side—Max. X: +/- 0.31 mm, Y: +/- 0.21 mm[4]
Bonding Area—X: +/- 28 mm, Y: +/- 33 mm[4]
Machine Accuracy (single bond)—±2.5 µm[4]
Machine Accuracy (multi-bonding)—±3.3 µm[4]
Max Bonding Wire Length—8 mm[4]
Loader/Unloader Type—Magazine Stacker Type[4]
Indexer Type—Center-Parting Type Universal Indexer[4]
Dimensions (W x D x H)—1080 x 950 x 1940 mm[4]
Mass—Approx. 590 kg[4]
Pattern Recognition Detection Method—Gray Scale Correlation[4]
Pattern Recognition Detection Speed—0.11 s max for 2-point alignment (including move time)[4]
Detection Area (Lead Side)—Max X: ±1.26 mm, Y: ±0.86 mm[4]
Detection Area (Die Side)—Max X: ±0.31 mm, Y: ±0.21 mm[4]
Wire Diameter (Gold Wire)—Ø15–38 µm, 2-inch double flange spool[4]
Applicable Lead Frame Width—20–80 mm[4]
Applicable Lead Frame Length—95–262 mm[4]
Applicable Lead Frame Thickness—0.07–0.3 mm[4]
Gold Wire—Ø 15 ~ 38 µm[4]
Width—20 ~ 80 mm[4]
Length—95 ~ 262 mm[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing