Comparison ledger
Applied Materials Reflexion, SCREEN AS 2000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ReflexionApplied Materials | AS 2000SCREEN |
|---|---|---|
| OEM | Applied Materials | SCREEN |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Reflexion | SCREEN AS 2000 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Dielectric, LK Oxide[2] | Dual brush and top side brush chambers, spin dry[5] |
| Wafer Sizes | 12 inch[2] | — |
| Process Type | Chemical Mechanical Polishing (CMP)[2] | — |
| OEM | Applied Materials[2] | — |
| Model | Reflexion[2] | — |
| Category | CMP (Chemical Mechanical Polisher)[2] | — |
| Wafer Size | 12 inch[2] | 8 inch[7] |
| Gas | — | 1:100 DHF, 1:100 NH4OH[5] |
| OS | — | Windows NT[5] |
| Power | — | 0.750KVA transformer[6] |
| Missing | — | HLS cards / condition not well[6] |
| Brush Chambers | — | Dual brush and top side brush chambers[5] |
| Spin Dry | — | Yes[5] |
| Process Gases | — | 1:100 DHF, 1:100 NH4OH[5] |
| Operating System | — | Windows NT[5] |
| Vintage Year (example unit) | — | 1998[5] |
| Vintage Year (another unit) | — | 1999[6] |