Comparison ledger
Applied Materials 0720 06060 Part, Teradyne ETS 600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | ETS 600Teradyne |
|---|---|---|
| OEM | Applied Materials | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Teradyne ETS |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[1] | Boards:[2] |
| APU-12 – Qty | — | 16, CH: 192[2] |
| HPU – Qty | — | 4, CH: 4[2] |
| SPU-112 – Qty | — | 12, CH: 24[2] |
| DPU-16 – Qty | — | 8, CH: 128[2] |
| QMS – Qty | — | 1, CH: 4[2] |
| CBIT-64 – Qty | — | 2, CH: 128[2] |
| QTMU – Qty | — | 2, CH: 8[2] |
| DAAU – Qty | — | 1, CH: 4[2] |
| MCU-66MHz – Qty | — | 1, CH: 16[2] |
| ISOCOM 64 – Qty | — | 4, CH: 128[2] |
| SPU-112 BOOSTER – Qty | — | 6, CH: 24[2] |
| HCMUX – Qty | — | 1, CH: 8[2] |
| MCU-CDB – Qty | — | 1, CH: 16[2] |
| APU-12 Quantity | — | 16[2] |
| APU-12 Channels | — | 192[2] |
| HPU Quantity | — | 4[2] |
| HPU Channels | — | 4[2] |
| SPU-112 Quantity | — | 12[2] |
| SPU-112 Channels | — | 24[2] |
| DPU-16 Quantity | — | 8[2] |
| DPU-16 Channels | — | 128[2] |
| QMS Quantity | — | 1[2] |
| QMS Channels | — | 4[2] |
| CBIT-64 Quantity | — | 2[2] |
| CBIT-64 Channels | — | 128[2] |
| QTMU Quantity | — | 2[2] |
| QTMU Channels | — | 8[2] |
| DAAU Quantity | — | 1[2] |
| DAAU Channels | — | 4[2] |
| MCU-66MHz Quantity | — | 1[2] |
| MCU-66MHz Channels | — | 16[2] |
| ISOCOM 64 Quantity | — | 4[2] |
| ISOCOM 64 Channels | — | 128[2] |
| SPU-112 BOOSTER Quantity | — | 6[2] |
| SPU-112 BOOSTER Channels | — | 24[2] |
| HCMUX Quantity | — | 1[2] |
| HCMUX Channels | — | 8[2] |
| MCU-CDB Quantity | — | 1[2] |
| MCU-CDB Channels | — | 16[2] |
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