Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps LW1089, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | LW1089Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps LW1089 |
| Specifications | ||
| Product area | — | Laser Welder[1] |
| Model listing | — | LW1089[1] |
| Machine type | — | Fully automatic laser welding system with a large working area[2] |
| Process | — | Fully and semi-automatic deep penetration welding[2] |
| Materials | — | Aluminum and copper leads[2] |
| Applications | — | DCB substrates, power electronics, battery cells and modules, and other electronics manufacturing components[2] |
| Working area (X×Y×Z) | — | 410 mm × 480 mm × 75* mm[2] |
| Laser beam source max. power | — | 1.5 kW[2] |
| Laser beam source wavelength | — | 1070 nm[2] |
| Beam quality | — | Single Mode[2] |
| Optics max. working area | — | 12 mm x 12 mm[2] |
| Optics max. power | — | 1.3 kW, cw[2] |
| Permissible wavelength | — | 1070 nm[2] |
| Focus spot diameter | — | < 50 µm[3] |
| Line welding speed | — | up to 1000 mm/s[2] |
| Wobble frequency | — | up to 1000 Hz[2] |
| Down hold force | — | up to 120 N[2] |
| Max. immersion depth | — | 100 mm[2] |
| P-rotation | — | 360°[2] |
| Footprint | — | 1480 x 2150 x min. 2092 mm[2] |
| External switch cabinet | — | 800 x 1000 x 2100 mm[2] |
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